Hi All,
I'm designing a PCB using surface mount components and I'm runnng out of room on the top side.
For the first few PCB's, I will probably hand assemble the prototypes myself but after that, I'm thinking of getting them commercially assembled.
So is there any thing I need to consider in regard to components on the bottom side?
Basically, I guess what I'm concerned about, is reflow ovens and the components falling of the bottom side whilst the top side is been soldered ???
The components I'm looking at putting on the bootom side are thngs like SMD RJ45, 0603 caps/Res, crystal, QFN48 etc.
Actually similar components on both sides. So I guess it makes no difference which side gets soldered first.
Thanks, Neil.
I'm designing a PCB using surface mount components and I'm runnng out of room on the top side.
For the first few PCB's, I will probably hand assemble the prototypes myself but after that, I'm thinking of getting them commercially assembled.
So is there any thing I need to consider in regard to components on the bottom side?
Basically, I guess what I'm concerned about, is reflow ovens and the components falling of the bottom side whilst the top side is been soldered ???
The components I'm looking at putting on the bootom side are thngs like SMD RJ45, 0603 caps/Res, crystal, QFN48 etc.
Actually similar components on both sides. So I guess it makes no difference which side gets soldered first.
Thanks, Neil.